3M Scotch-Weld Epoxy Potting Compound DP270 Clear, 200 mL-Shop 3M

UPC# 00 021200 87834 3 3M ID 62326238300

Description

Electrical grade, two-part, for potting and bonding electronic components. Electrolytically non-corrosive to copper, non-exotherming and high flow. It can be used for potting and bonding electronic components, and is electrolytically non-corrosive to copper. It has a 1:1 mix ratio and is a non-exotherming, high flow, clear product with a 70-minute worklife.

Features and Benefits:

Non-corrosive to copper
Low viscosity
Markets: General industrial, sporting goods, solar energy, wind energy, composites, electronics, military, transportation and aerospace
Applications: Bonding, gluing, joining, attaching, assembling, encapsulating, potting and sealing

Description

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Customer Reviews

Packaged in convenient Duo-Pak cartridges designed for use with 3M™ EPX™ Applicators.

Applicator and mixing nozzles sold separately.

Product Details

Chemical Base	Epoxy
Color	Clear
Container Volume	200 Millilitre
Flammability Rating--USA	UL94 HB
Full Cure Time Temperature Time	48 hours @ 23 C (73 F)
Hardness	80 Shore D
Mix Ratio	1 : 0.85
Mix Ratio Volume	1 : 1
Peel Strength at 72 Degrees F (22 Degrees C)	2 Pound Per Inch (Of Width)
Physical Form	Paste
Product Form	Each
Shear Strength at 72 Degrees F (22 Degrees C)	2500 Pound-Force Per Square Inch
Shelf Life	15 Month
Storage Temperature	72 Degree Fahrenheit
Time to Handling Strength	3 Hour
Type	Potting Compound
Worklife	60-70 minutes @ 23 C (73 F)